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Modeling and Simulation for Microelectronic Packaging Assembly

- Manufacturing, Reliability and Testing

av Yong Liu, Shen (Huazhong University of Science and Technology Liu
Modeling and Simulation for Microelectronic Packaging Assembly av Yong Liu
Om Modeling and Simulation for Microelectronic Packaging Assembly

An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

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  • Språk:
  • Engelska
  • ISBN:
  • 9780470827802
  • Format:
  • Inbunden
  • Sidor:
  • 576
  • Utgiven:
  • 21 Oktober 2011
  • Mått:
  • 175x252x36 mm.
  • Vikt:
  • 1134 g.
Leveranstid: 2-4 veckor
Förväntad leverans: 18 Oktober 2024

Om Yong Liu

Se alla böcker av Yong Liu

Beskrivning av Modeling and Simulation for Microelectronic Packaging Assembly

An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

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