Böcker i Springer Tracts in Electrical-serien

This book is on the nonlinear random medium analysis that includes subtopics of terahertz imaging, inverse scattering, plasmonics, quantum optics/communication laser modes, and terahertz photonic antennas. Here in this book, a mathematical framework is developed to analyze the impact of dimensions and chemical potential on nano-antenna channels.

This book describes the technologies of wireless power beaming to the aerospace crafts, such as the drone, flying car, aircraft, spacecraft, and rocket. Using a highly directional electromagnetic wave beam, energy is remotely supplied to mobility that moves at high speed without waste, and it is efficiently converted into the driving force of mobility. This technology will be indispensable for the full electrification of mobility in the future.¿This book specializes in aerospace mobility, where weight and other constraints are strict, and was written by researchers in different disciplines such as rocket engineering, plasma engineering, laser engineering, and communications and control engineering. Beamed-mobility forms a new area of integrated engineering. The new combination of optics and mechanical engineering creates a world where mobility is free to supply the energy needed for propulsion, wherever and wherever it goes. It is expected to become the core technology of mobility, energy, infrastructure, and services of the future society that extends to outer space. This book will serve as a good reference for graduate students, researchers, and professional engineers in the field of aerospace, electrical, and mechanical engineering.

This book covers two broad domains: state-of-the-art research in GaN HEMT and Ga2O3 HEMT. Each technology covers materials system, band engineering, modeling and simulations, fabrication techniques, and emerging applications. The book presents basic operation principles of HEMT, types of HEMT structures, and semiconductor device physics to understand the device behavior. The book presents numerical modeling of the device and TCAD simulations for high-frequency and high-power applications. The chapters include device characteristics of HEMT including 2DEG density, Id-Vgs, Id-Vds, transconductance, linearity, and C-V. The book emphasizes the state-of-the-art fabrication techniques of HEMT and circuit design for various applications in low noise amplifier, oscillator, power electronics, and biosensor applications. The book focuses on HEMT applications to meet the ever-increasing demands of the industry, innovation in terms of materials, design, modeling, simulation, processes, and circuits. The book will be primarily helpful to undergraduate/postgraduate, researchers, and practitioners in their research.

This book provides an excellent review and analysis of the latest information on rechargeable Li-S battery research. With a clear and concise writing style and in-depth technical material, this book will appeal to undergraduates and graduates, researchers, chemists, material scientists, and physicists working in the field of energy storage, especially those with an interest in Li-S battery technology. IEEE Electrical Insulation Magazine shows lithium-sulfur (Li-S) batteries give us an alternative to the more prevalent lithium-ion (Li-ion) versions and are known for their observed high-energy densities. Systems using Li-S batteries are in the early stages of development, and commercialization however could potentially provide higher, safer levels of energy at significantly lower cost. In this book, the history, scientific background, challenges, and future perspectives of the lithium-sulfur system are presented by experts in the field. Focus is on past and recent advances of each cell compartment responsible for the performance of the Li-S battery and includes analysis of characterization tools, new designs, and computational modeling. As a comprehensive review of the current state of play, it is ideal for undergraduates, graduate students, researchers, physicists, chemists, and materials scientists interested in energy storage, material science, and electrochemistry.

This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "e;mounting defects"e; shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.

This book provides comprehensive coverage of different aspects of low-power circuit synthesis for IoT applications at various levels of the design hierarchy, starting from the layout level to the system level. For a seamless understanding of the subject, the basics of MOS circuits have been introduced at the transistor, gate and circuit level, followed by various low-power design methodologies, such as supply voltage scaling, switched capacitance minimization techniques, and leakage power minimization approaches. The contents of this book are useful to students, researchers, as well as practicing engineers. Low-power architectures refer to the latest development in computer microchips which are created by integrating hundreds of thousands of transistors on one chip for different IoT applications. Emerging research in this area has the potential to uncover further applications for IoT in addition to system advancements.

The book consists of the latest research in biomedical and communication integration. It discusses the fabrication and testing outcomes of the Internet of Things-enabled biomedical applications. The book focuses on recent advances in the field of planar antenna design and their applications in space communication, mobile communication, wireless communication, and wearable applications. Planar antennas are also used in medical applications in microwave imaging, medical implants, hyperthermia treatments, and wireless wellness monitoring. This book presents planar antenna design concepts, methods, and techniques to enhance the performance parameters and applications for IoT and device-to-device communication. It provides the latest techniques used for the design of antennas in terms of their structures, defected ground, MIMO, and fractal design. This book also addresses the specific steps to resolve issues in designing antennas and how to design conformal and miniaturized antenna structures for various applications.

This book discusses the evolution of multigate transistors, the design challenges of transistors for high-frequency applications, and the design and modeling of multigate transistors for high-frequency applications. The contents particularly focus on the cut-off frequency and maximum oscillation frequency of different multigate structures. RF stability modeling for multigate transistors is presented, which can help to understand the relation between the small-signal parameter and the physical parameter of the device for optimization. This is a useful reference to those in academia and industry.