As the first book to introduce and analyze cultural studies in contemporary China, this volume is an important resource for Western scholars wishing to understand the rise and development of cultural studies in China.
Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and design exploration. Finally, it discusses details of beyond-die signal and power integrity and physical implementation.
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