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  • av Tzyy-Sheng Jason Horng & Lih-Tyng Hwang
    1 656,-

    An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments* Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility* Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab* Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail* Provides chapter-wise review questions and powerpoint slides as teaching tools

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