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3D Integration in VLSI Circuits

- Implementation Technologies and Applications

Om 3D Integration in VLSI Circuits

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I

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  • Språk:
  • Engelska
  • ISBN:
  • 9781032095547
  • Format:
  • Häftad
  • Sidor:
  • 234
  • Utgiven:
  • 30. juni 2021
  • Mått:
  • 156x234x0 mm.
  • Vikt:
  • 426 g.
  Fri leverans
Leveranstid: 2-4 veckor
Förväntad leverans: 18. december 2024

Beskrivning av 3D Integration in VLSI Circuits

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I

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