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  5. Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

av Yue Ma
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement av Yue Ma
Om Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

New insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

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  • Språk:
  • Engelska
  • ISBN:
  • 9780367023430
  • Format:
  • Inbunden
  • Sidor:
  • 226
  • Utgiven:
  • 28 Mars 2019
  • Mått:
  • 241x164x16 mm.
  • Vikt:
  • 506 g.
  Fri leverans
Leveranstid: 2-4 veckor
Förväntad leverans: 11 Oktober 2024

Om Yue Ma

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Beskrivning av Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

New insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

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