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Testing of Interposer-Based 2.5D Integrated Circuits

Om Testing of Interposer-Based 2.5D Integrated Circuits

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

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  • Språk:
  • Engelska
  • ISBN:
  • 9783319854618
  • Format:
  • Häftad
  • Sidor:
  • 182
  • Utgiven:
  • 9. maj 2018
  • Utgåva:
  • 12017
  • Mått:
  • 155x235x0 mm.
  • Vikt:
  • 3051 g.
  Fri leverans
Leveranstid: 2-4 veckor
Förväntad leverans: 6. december 2024

Beskrivning av Testing of Interposer-Based 2.5D Integrated Circuits

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

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