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  4. Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

av Juan Cepeda-Rizo

del av Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems-serien

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments av Juan Cepeda-Rizo
Om Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

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  • Språk:
  • Engelska
  • ISBN:
  • 9781032160818
  • Format:
  • Inbunden
  • Sidor:
  • 290
  • Utgiven:
  • 30 December 2021
  • Mått:
  • 243x224x24 mm.
  • Vikt:
  • 592 g.
  Fri leverans
Leveranstid: 2-4 veckor
Förväntad leverans: 23 Juli 2024

Om Juan Cepeda-Rizo

Se alla böcker av Juan Cepeda-Rizo

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This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

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