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  4. Three-Dimensional Molded Interconnect Devices (3D-MID)

Three-Dimensional Molded Interconnect Devices (3D-MID)

- Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

av Jorg Franke
Three-Dimensional Molded Interconnect Devices (3D-MID) av Jorg Franke
Om Three-Dimensional Molded Interconnect Devices (3D-MID)

Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

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  • Språk:
  • Engelska
  • ISBN:
  • 9781569905517
  • Format:
  • Inbunden
  • Sidor:
  • 356
  • Utgiven:
  • 30 April 2014
  • Mått:
  • 174x246x25 mm.
  • Vikt:
  • 1001 g.
Leveranstid: 2-4 veckor
Förväntad leverans: 30 Juli 2024

Om Jorg Franke

Se alla böcker av Jorg Franke

Beskrivning av Three-Dimensional Molded Interconnect Devices (3D-MID)

Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

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