Marknadens största urval
Snabb leverans

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

Om New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

Visa mer
  • Språk:
  • Engelska
  • ISBN:
  • 9783031008993
  • Format:
  • Häftad
  • Sidor:
  • 84
  • Utgiven:
  • 16. februari 2016
  • Mått:
  • 191x6x235 mm.
  • Vikt:
  • 176 g.
  Fri leverans
Leveranstid: 2-4 veckor
Förväntad leverans: 16. december 2024

Beskrivning av New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

Användarnas betyg av New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation



Hitta liknande böcker
Boken New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation finns i följande kategorier:

Gör som tusentals andra bokälskare

Prenumerera på vårt nyhetsbrev för att få fantastiska erbjudanden och inspiration för din nästa läsning.